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Description
ROTH ELEKTRONIK - RE230-LF - PCB, Epoxy Glass Composite, 1.6mm, 114.3mm x 165.1mm
- Board Type: Matrix Board
- Board Material: Epoxy Glass Composite
- Hole Diameter: 1.02mm
- External Height: 114.3mm
- External Width: 165.1mm
- Board Thickness: 1.6mm
- SVHC: No SVHC (15-Jan-2019)
- Copper Coating Density: HAL 5 - 6 µm (hole 2 - 3 µm)
- Copper Thickness: 35µm
- External Length / Height: 114.3mm
- Hole Matrix: 40 x 60
- Hole Pitch: 2.54mm
- Material: Epoxied FR4
- No. of Copper Coated Sides: 1
- No. of Holes: 2400
- PCB Size: 114.30 x 165.10 mm (4.5 x 6.5 ")
- Pad Area: 2.00 mm²
- Pitch Spacing: 2.54mm