Documents et téléchargements
Description
FISCHER ELEKTRONIK - ICK BGA 27X27 - Heat Sink, For Ball Grid Array, 20 °C/W, BGA, 27 mm, 6 mm, 27 mm
- Thermal Resistance: 20°C/W
- Packages Cooled: BGA
- External Width - Metric: 27mm
- External Height - Metric: 6mm
- External Length - Metric: 27mm
- External Diameter - Metric: -
- Heat Sink Material: Aluminium
- External Width - Imperial: 1.06"
- External Height - Imperial: 0.24"
- External Length - Imperial: 1.06"
- External Diameter - Imperial: -
- Product Range: -
- SVHC: No SVHC (15-Jan-2019)
- Surface Finish: Plain