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description
BOYD - 374124B00035G - Heat Sink, Square, PCB, For Ball Grid Arrays, 23.4 °C/W, BGA, 23 mm, 18 mm, 23 mm
- Thermal Resistance: 23.4°C/W
- Packages Cooled: BGA
- External Width - Metric: 23mm
- External Height - Metric: 18mm
- External Length - Metric: 23mm
- External Diameter - Metric: -
- Heat Sink Material: Aluminium
- External Width - Imperial: 0.9"
- External Height - Imperial: 0.7"
- External Length - Imperial: 0.9"
- External Diameter - Imperial: -
- Product Range: -
- SVHC: No SVHC (15-Jan-2019)